Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes
Journal of Mechanical Engineering and Sciences
, Volume 9, Issue , 2015,
Intermetallic evolution for isothermal aging up to 2000 hours on Sn-4Ag-0.5Cu and Sn-37Pb solders with Ni/Au layers
Saliza Azlina O.S.
Siti Rabiatul Aisha I.
International Journal of Automotive and Mechanical Engineering
, Volume 8, Issue 1, 2013,